N-SERIES · MULTI-NODEOPEN RACK

GL-N2OU-3N

3 nodes · Open Rack

2OU multi-node server with 3 nodes for Open Rack (1.5 nodes/OU). One chassis, 3 host platforms: AMD EPYC 9005, AMD EPYC 9004 and AMD EPYC 8005/8004. Validated with GenesysBench™ and deployed under GLIDS.

NVMe bays: 4×
Nodes: 3
Height: 2OU
Sockets: 1

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Specifications

Pick the host platform. The chassis, power and cooling follow it.

GL-N2OU-3N: AMD EPYC 9005 specifications
Form factor	2OU, three-bay Shelf for Open Rack V3
Processor	1 Socket SP5 (LGA6096); AMD EPYC™ 9005/9004 (with AMD 3D V-Cache™ Technology) and 97x4 series processors Up to 400W
Memory	8 DDR5 288-pin (1DPC); RDIMM up to 128GB each, max. 6400MT/sRDIMM-3DS up to 256GB each, max. 6400MT/s
Storage	1 HHHL PCIe5.0 x16 1 OCP NIC 3.0 (PCIe5.0 x16)4 hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays2 M-key (PCIe5.0 x4 or SATA 6Gb/s), support 22110/2280 form factor
Power	1 IT Gear connector for ORv3 50/48V busbarCentralized 50/48V busbar, distributing up to 1600W per sled
Cooling	2 system fans (80 x 38mm)
Dimensions (D × W × H)	537 x 803 x 93mm (21.1'' x 31.6'' x 3.7'', shelf dimensions)
Management	Dedicated BMC (IPMI) TPM (13-pin, SPI)

GL-N2OU-3N: AMD EPYC 9004 specifications
Form factor	2OU, three-bay Shelf for Open Rack V3
Processor	1 Socket SP5 (LGA6096); AMD EPYC™ 9005/9004 (with AMD 3D V-Cache™ Technology) and 97x4 series processors
Storage	1 HHHL PCIe5.0 x16 1 OCP NIC 3.0 (PCIe5.0 x16)4 hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays2 M-key (PCIe5.0 x4 or SATA 6Gb/s), support 22110/2280 form factor
Power	1 IT Gear connector for ORv3 50V busbarCentralized 50V busbar to /1V distributed up to 1000W
Cooling	2 system fans (80 x 56 mm)
Dimensions (D × W × H)	573 x 800 x 88 mm (D/W/H, Shelf Dimensions)
Management	Dedicated BMC (IPMI) TPM (13-pin, SPI) accessory

GL-N2OU-3N: AMD EPYC 8005/8004 specifications
Form factor	2OU, Three-bay Shelf for ORv3
Processor	1 Socket SP6 (LGA 4844) AMD EPYC™ 8005/8004 series processors
Memory	10 DDR5 288-pin DIMM slots; RDIMM, RDIMM-3DS
Storage	1 HHHL PCIe5.0 x164 Hot-swap 2.5” NVMe (PCIe4.0 x4) drive bay2 M-key (PCIe5.0 x4 or SATA 6Gb/s), 22110/2280 form factor
Power	1 IT Gear connector for ORv3 50V busbarCentralized 50V busbar to /1V distributed up to 1000W
Cooling	2 system fans (80 x 56 mm)
Dimensions (D × W × H)	573 x 800 x 88 mm (22.56'' x 31.5'' x 3.5'', Shelf Dimensions)
Management	ASPEED BMC AST2600

Exact CPU, memory, drive and network parts are fixed on your quote. Open Rack sleds use the OU height unit. GPU and platform names are trademarks of their respective owners.